Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721926 | Semiconductor device having stacked semiconductor chips interconnected via TSV and method of fabricating the same | Yeong-Hwan Choe, Tae-Joo Hwang, Tae Hong Min, Sang-Uk Han | 2017-08-01 |
| 9721930 | Semiconductor package and method for fabricating the same | Hyoungjoo Lee, Minsoo Kim, Teak-Hoon Lee | 2017-08-01 |
| 9589947 | Semiconductor packages and methods of manufacturing the same | Jihwan Hwang, Jung-Hwan Kim, Tae Hong Min, Kwang-chul Choi | 2017-03-07 |
| 9543276 | Chip-stacked semiconductor package | Tae Hong Min, Sun-kyoung Seo | 2017-01-10 |