Issued Patents 2017
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9831202 | Semiconductor devices with solder-based connection terminals and method of forming the same | Seung-Kwan Ryu, Ju-Il Choi, Tae-Je Cho, Yong-Hwan Kwon | 2017-11-28 |
| 9666551 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Seung-Kwan Ryu, Cha-Jea Jo, Tae-Je Cho | 2017-05-30 |
| 9543276 | Chip-stacked semiconductor package | Young Kun Jee, Tae Hong Min | 2017-01-10 |