Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728424 | Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate | Ji Hwang Kim, Un-Byoung Kang, Tae-Je Cho | 2017-08-08 |
| 9666551 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Sun-kyoung Seo, Seung-Kwan Ryu, Tae-Je Cho | 2017-05-30 |
| 9618716 | Photonic integrated circuit | Sang Cheon Park, Tae-Je Cho | 2017-04-11 |
| 9589945 | Semiconductor package having stacked semiconductor chips | Yun-Hyeok Im, Tae-Je Cho | 2017-03-07 |
| 9543231 | Stacked semiconductor package | Yun-Seok Choi, Hyeok-man Kwon, Tae-Je Cho | 2017-01-10 |