Issued Patents 2017
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9761477 | Pre-package and methods of manufacturing semiconductor package and electronic device using the same | Gun-ho Chang, Tae-Je Cho | 2017-09-12 |
| 9728424 | Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate | Ji Hwang Kim, Cha-Jea Jo, Tae-Je Cho | 2017-08-08 |
| 9601465 | Chip-stacked semiconductor package and method of manufacturing the same | Tae-Je Cho, Byung-Hyug Roh | 2017-03-21 |
| 9595446 | Methods of processing substrates | Chungsun Lee, Jung-Hwan Kim, Kwang-chul Choi, Jeon Il Lee | 2017-03-14 |