Issued Patents 2017
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853012 | Semiconductor packages having through electrodes and methods of fabricating the same | Hyunsoo Chung, Jongyeon Kim, In-Young Lee | 2017-12-26 |
| 9831202 | Semiconductor devices with solder-based connection terminals and method of forming the same | Sun-kyoung Seo, Seung-Kwan Ryu, Ju-Il Choi, Yong-Hwan Kwon | 2017-11-28 |
| 9761477 | Pre-package and methods of manufacturing semiconductor package and electronic device using the same | Gun-ho Chang, Un-Byoung Kang | 2017-09-12 |
| 9728424 | Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate | Ji Hwang Kim, Un-Byoung Kang, Cha-Jea Jo | 2017-08-08 |
| 9666551 | Semiconductor chip, semiconductor package including the same, and method of manufacturing semiconductor chip | Sun-kyoung Seo, Seung-Kwan Ryu, Cha-Jea Jo | 2017-05-30 |
| 9618716 | Photonic integrated circuit | Sang Cheon Park, Cha-Jea Jo | 2017-04-11 |
| 9601465 | Chip-stacked semiconductor package and method of manufacturing the same | Un-Byoung Kang, Byung-Hyug Roh | 2017-03-21 |
| 9589945 | Semiconductor package having stacked semiconductor chips | Cha-Jea Jo, Yun-Hyeok Im | 2017-03-07 |
| 9543231 | Stacked semiconductor package | Yun-Seok Choi, Hyeok-man Kwon, Cha-Jea Jo | 2017-01-10 |