Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9853012 | Semiconductor packages having through electrodes and methods of fabricating the same | Hyunsoo Chung, Jongyeon Kim, Tae-Je Cho | 2017-12-26 |
| 9589930 | Semiconductor package including stepwise stacked chips | Chul-Hong Park, Kilsoo Kim | 2017-03-07 |