Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9728424 | Method of fabricating a packaged integrated circuit with through-silicon via an inner substrate | Un-Byoung Kang, Cha-Jea Jo, Tae-Je Cho | 2017-08-08 |
| 9646895 | Semiconductor package and manufacturing method thereof | Seungduk Baek, Taeje Cho | 2017-05-09 |