Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793250 | Package board, method for manufacturing the same and package on package having the same | Myung Sam Kang, Young Gwan Ko, Hye Jin Kim, Hye Won Jung | 2017-10-17 |
| 9699885 | Circuit board including heat dissipation structure | Tae Hong Min, Myung Sam Kang, Young Gwan Ko | 2017-07-04 |