Issued Patents 2017
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9839126 | Printed circuit board and method of manufacturing the same | Young Kwan Lee, Seung Eun Lee, Seung Yeop Kook | 2017-12-05 |
| 9832856 | Circuit board | Tae Hong Min, Young Gwan Ko | 2017-11-28 |
| 9832866 | Multilayered substrate and method of manufacturing the same | Seok Hwan AHN, Mi Sun Hwang, Young Gwan Ko, Jong Seok Bae | 2017-11-28 |
| 9832885 | Circuit board, electronic component and method of manufacturing circuit board | Ki Jung SUNG, Seung Yeop Kook, Seung Eun Lee | 2017-11-28 |
| 9793250 | Package board, method for manufacturing the same and package on package having the same | Young Gwan Ko, Hye Jin Kim, Hye Won Jung, Min Jae Seong | 2017-10-17 |
| 9699885 | Circuit board including heat dissipation structure | Tae Hong Min, Young Gwan Ko, Min Jae Seong | 2017-07-04 |
| 9655229 | Circuit board | Tae Hong Min, Young Gwan Ko | 2017-05-16 |
| 9554466 | Printed circuit board and method of manufacturing the same | Young Gwan Ko, Sang Hoon Kim, Kang Wook Bong, Hye Won Jung, Yong Wan Ji | 2017-01-24 |