Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9793250 | Package board, method for manufacturing the same and package on package having the same | Myung Sam Kang, Young Gwan Ko, Hye Jin Kim, Min Jae Seong | 2017-10-17 |
| 9554466 | Printed circuit board and method of manufacturing the same | Myung Sam Kang, Young Gwan Ko, Sang Hoon Kim, Kang Wook Bong, Yong Wan Ji | 2017-01-24 |