Issued Patents 2017
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847253 | Package-on-package using through-hole via die on saw streets | Byung Tai Do, Heap Hoe Kuan | 2017-12-19 |
| 9666500 | Semiconductor device and method of forming insulating layer disposed over the semiconductor die for stress relief | Yaojian Lin, Pandi C. Marimuthu, Kang Chen, Hin Hwa Goh, Yu Gu +4 more | 2017-05-30 |
| 9620557 | Semiconductor device and method of forming EWLB semiconductor package with vertical interconnect structure and cavity region | Lee Sun Lim, Rui Huang, Xu Sheng Bao, Ma Phoo Pwint Hlaing | 2017-04-11 |
| 9607965 | Semiconductor device and method of controlling warpage in reconstituted wafer | Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Yaojian Lin | 2017-03-28 |
| 9559029 | Semiconductor device and method of forming interconnect structure for encapsulated die having pre-applied protective layer | Il Kwon Shim, Yaojian Lin | 2017-01-31 |