Issued Patents 2017
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9847304 | Electronic device packages with conformal EMI shielding and related methods | Eric J. Li, Joshua D. Heppner, Mitul Modi | 2017-12-19 |
| 9786517 | Ablation method and recipe for wafer level underfill material patterning and removal | Lars D. Skoglund, Anil R. Indluru, Edward R. Prack, Danish Faruqui, Tyler N. Osborn +2 more | 2017-10-10 |
| 9721906 | Electronic package with corner supports | Manish Dubey, Baris Bicen, Digvijay A. Raorane, Bharat P. Penmecha | 2017-08-01 |
| 9704811 | Perforated conductive material for EMI shielding of semiconductor device and components | Joshua D. Heppner, Mitul Modi, Anna M. Prakash | 2017-07-11 |
| 9685413 | Semiconductor package having an EMI shielding layer | Anna M. Prakash, Reynaldo A. Olmedo, Venmathy McMahan, Joshua D. Heppner, Ann Jinyan Xu +2 more | 2017-06-20 |
| 9591758 | Flexible electronic system with wire bonds | Aleksandar Aleksov, Mauro J. Kobrinsky, Johanna M. Swan | 2017-03-07 |