| 9842808 |
Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die |
HanGil Shin, NamJu Cho |
2017-12-12 |
| 9748157 |
Integrated circuit packaging system with joint assembly and method of manufacture thereof |
HanGil Shin, NamJu Cho, Kyung-Moon Kim |
2017-08-29 |
| 9735113 |
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP |
NamJu Cho, Junwoo Myung |
2017-08-15 |
| 9721921 |
Semiconductor device and method of bonding semiconductor die to substrate in reconstituted wafer form |
KyungMoon Kim, KooHong Lee, JaeHak Yee, YoungChul Kim, Lan H. Hoang +3 more |
2017-08-01 |
| 9691707 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package |
HanGil Shin, NamJu Cho |
2017-06-27 |
| 9679769 |
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof |
Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong |
2017-06-13 |
| 9673171 |
Integrated circuit packaging system with coreless substrate and method of manufacture thereof |
HeeSoo Lee, OMin Kwon |
2017-06-06 |
| 9558965 |
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint |
NamJu Cho, HanGil Shin |
2017-01-31 |