Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693455 | Integrated circuit packaging system with plated copper posts and method of manufacture thereof | Seong Won Park, Hun Teak Lee, WoonJae Beak, Minjung Kim, Changhwan Kim +2 more | 2017-06-27 |
| 9685543 | Thin film activation method using electrical energy and thin film transistor fabrication method | Hyun-Jae Kim, Doo Hyun YOON, Tae Soo Jung, Young Jun Tak, Wongi KIM +1 more | 2017-06-20 |
| 9673171 | Integrated circuit packaging system with coreless substrate and method of manufacture thereof | HeeJo Chi, OMin Kwon | 2017-06-06 |