Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9693455 | Integrated circuit packaging system with plated copper posts and method of manufacture thereof | Seong Won Park, WoonJae Beak, Minjung Kim, Changhwan Kim, ByungHyun Kwak +2 more | 2017-06-27 |