| 9721925 |
Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure |
Henry Descalzo Bathan, Jairus Legaspi Pisigan |
2017-08-01 |
| 9679769 |
Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof |
Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, Dao Nguyen Phu Cuong, HeeJo Chi |
2017-06-13 |
| 9666540 |
Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die |
Frederick R. Dahilig, Lionel Chien Hui Tay, Dioscoro A. Merilo |
2017-05-30 |
| 9659897 |
Integrated circuit packaging system with interposer structure and method of manufacture thereof |
Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan |
2017-05-23 |
| 9589876 |
Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection |
Lionel Chien Hui Tay, Henry Descalzo Bathan, Dioscoro A. Merilo, Jeffrey D. Punzalan |
2017-03-07 |