Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659897 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong | 2017-05-23 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan, Dioscoro A. Merilo | 2017-03-07 |