Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9721925 | Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure | Zigmund Ramirez Camacho, Jairus Legaspi Pisigan | 2017-08-01 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Dioscoro A. Merilo, Jeffrey D. Punzalan | 2017-03-07 |