Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666540 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Dioscoro A. Merilo | 2017-05-30 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Henry Descalzo Bathan, Dioscoro A. Merilo, Jeffrey D. Punzalan | 2017-03-07 |