Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9666540 | Semiconductor device and method of forming prefabricated heat spreader frame with embedded semiconductor die | Frederick R. Dahilig, Zigmund Ramirez Camacho, Lionel Chien Hui Tay | 2017-05-30 |
| 9589876 | Semiconductor device and method of forming a wafer level package with top and bottom solder bump interconnection | Zigmund Ramirez Camacho, Lionel Chien Hui Tay, Henry Descalzo Bathan, Jeffrey D. Punzalan | 2017-03-07 |
| 9589910 | Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die | Reza A. Pagaila | 2017-03-07 |