Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9659897 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Dao Nguyen Phu Cuong, Jeffrey D. Punzalan | 2017-05-23 |