Issued Patents 2017
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9679769 | Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof | Zigmund Ramirez Camacho, Bartholomew Liao Chung Foh, Sheila Marie L. Alvarez, HeeJo Chi | 2017-06-13 |
| 9659897 | Integrated circuit packaging system with interposer structure and method of manufacture thereof | Zigmund Ramirez Camacho, Emmanuel Espiritu, Bartholomew Liao Chung Foh, Jeffrey D. Punzalan | 2017-05-23 |