Issued Patents 2017
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9842808 | Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die | NamJu Cho, HeeJo Chi | 2017-12-12 |
| 9748157 | Integrated circuit packaging system with joint assembly and method of manufacture thereof | HeeJo Chi, NamJu Cho, Kyung-Moon Kim | 2017-08-29 |
| 9691707 | Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package | HeeJo Chi, NamJu Cho | 2017-06-27 |
| 9558965 | Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint | HeeJo Chi, NamJu Cho | 2017-01-31 |