| 9842808 |
Semiconductor device and method of forming vertical interconnect in FO-WLCSP using leadframe disposed between semiconductor die |
HanGil Shin, HeeJo Chi |
2017-12-12 |
| 9748157 |
Integrated circuit packaging system with joint assembly and method of manufacture thereof |
HeeJo Chi, HanGil Shin, Kyung-Moon Kim |
2017-08-29 |
| 9735113 |
Semiconductor device and method of forming ultra thin multi-die face-to-face WLCSP |
HeeJo Chi, Junwoo Myung |
2017-08-15 |
| 9730256 |
Method and apparatus for discovering device in wireless communication network |
Changsoon Kim, Byunghoon Seo, Jongmu Choi, Hakkwan Kim, Chanki Cho |
2017-08-08 |
| 9691707 |
Semiconductor device and method of forming 3D dual side die embedded build-up semiconductor package |
HeeJo Chi, HanGil Shin |
2017-06-27 |
| 9578494 |
Method and apparatus for allocating IP address in wireless communication network |
Jongmu Choi, Changsoon Kim, Hakkwan Kim |
2017-02-21 |
| 9558965 |
Semiconductor device with thin profile WLCSP with vertical interconnect over package footprint |
HeeJo Chi, HanGil Shin |
2017-01-31 |
