Issued Patents 2017
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748157 | Integrated circuit packaging system with joint assembly and method of manufacture thereof | HeeJo Chi, HanGil Shin, NamJu Cho | 2017-08-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9748157 | Integrated circuit packaging system with joint assembly and method of manufacture thereof | HeeJo Chi, HanGil Shin, NamJu Cho | 2017-08-29 |