Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520323 | Microelectronic packages having trench vias and methods for the manufacture thereof | Michael B. Vincent, Scott M. Hayes, Douglas G. Mitchell | 2016-12-13 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Scott M. Hayes, Alan J. Magnus, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9362211 | Exposed pad integrated circuit package with mold lock | Wei Gao, Yanting Tian, Jinzhong Yao, Dehong Ye | 2016-06-07 |
| 9331029 | Microelectronic packages having mold-embedded traces and methods for the production thereof | Michael B. Vincent, Jason Wright | 2016-05-03 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Trung Q. Duong, Scott M. Hayes, Douglas G. Mitchell, Michael B. Vincent +2 more | 2016-03-08 |
| 9281284 | System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereof | Weng F. Yap | 2016-03-08 |
| 9257393 | Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof | Weng F. Yap | 2016-02-09 |
| 9257415 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Michael B. Vincent, Scott M. Hayes, Jason Wright | 2016-02-09 |