Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell, Michael B. Vincent +2 more | 2016-03-08 |