| 9524950 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof |
Weng F. Yap |
2016-12-20 |
| 9520323 |
Microelectronic packages having trench vias and methods for the manufacture thereof |
Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell |
2016-12-13 |
| 9502363 |
Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers |
Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus, Douglas G. Mitchell +3 more |
2016-11-22 |
| 9396999 |
Wafer level packaging method |
Weng F. Yap |
2016-07-19 |
| 9355985 |
Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof |
Scott M. Hayes |
2016-05-31 |
| 9331029 |
Microelectronic packages having mold-embedded traces and methods for the production thereof |
Zhiwei Gong, Jason Wright |
2016-05-03 |
| 9305911 |
Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication |
Jason Wright, Weng F. Yap |
2016-04-05 |
| 9299670 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof |
Weng F. Yap, Jason Wright |
2016-03-29 |
| 9281293 |
Microelectronic packages having layered interconnect structures and methods for the manufacture thereof |
Alan J. Magnus, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell +2 more |
2016-03-08 |
| 9263420 |
Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication |
Scott M. Hayes |
2016-02-16 |
| 9257415 |
Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof |
Scott M. Hayes, Jason Wright, Zhiwei Gong |
2016-02-09 |
| 9245819 |
Embedded electrical component surface interconnect |
— |
2016-01-26 |