Issued Patents 2016
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9524950 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Michael B. Vincent | 2016-12-20 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus +3 more | 2016-11-22 |
| 9472528 | Integrated electronic package and method of fabrication | — | 2016-10-18 |
| 9401339 | Wafer level packages having non-wettable solder collars and methods for the fabrication thereof | Alan J. Magnus | 2016-07-26 |
| 9396999 | Wafer level packaging method | Michael B. Vincent | 2016-07-19 |
| 9362234 | Shielded device packages having antennas and related fabrication methods | Eduard Jan Pabst, Sergio Pacheco | 2016-06-07 |
| 9343414 | Microelectronic packages having radio frequency stand-off layers | Eduard Jan Pabst | 2016-05-17 |
| 9312206 | Semiconductor package with thermal via and method for fabrication thereof | Scott M. Hayes | 2016-04-12 |
| 9305911 | Devices and stacked microelectronic packages with package surface conductors and adjacent trenches and methods of their fabrication | Michael B. Vincent, Jason Wright | 2016-04-05 |
| 9299670 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Michael B. Vincent, Jason Wright | 2016-03-29 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell +2 more | 2016-03-08 |
| 9281286 | Microelectronic packages having texturized solder pads and methods for the fabrication thereof | Alan J. Magnus | 2016-03-08 |
| 9281284 | System-in-packages having vertically-interconnected leaded components and methods for the fabrication thereof | Zhiwei Gong | 2016-03-08 |
| 9257393 | Fan-out wafer level packages containing embedded ground plane interconnect structures and methods for the fabrication thereof | Zhiwei Gong | 2016-02-09 |
| 9257419 | Leadframe-based system-in-packages having sidewall-mounted surface mount devices and methods for the production thereof | — | 2016-02-09 |