Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9458012 | Method for shielding MEMS structures during front side wafer dicing | Vijay Sarihan | 2016-10-04 |
| 9455216 | Semiconductor device package and method of manufacture | Dwight L. Daniels, Stephen R. Hooper, Justin E. Poarch | 2016-09-27 |
| 9401339 | Wafer level packages having non-wettable solder collars and methods for the fabrication thereof | Weng F. Yap | 2016-07-26 |
| 9401338 | Electronic devices with embedded die interconnect structures, and methods of manufacture thereof | Francisco Chaidez | 2016-07-26 |
| 9346671 | Shielding MEMS structures during wafer dicing | Chad S. Dawson, Stephen R. Hooper | 2016-05-24 |
| 9281286 | Microelectronic packages having texturized solder pads and methods for the fabrication thereof | Weng F. Yap | 2016-03-08 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Douglas G. Mitchell, Michael B. Vincent +2 more | 2016-03-08 |