Issued Patents 2016
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9520323 | Microelectronic packages having trench vias and methods for the manufacture thereof | Michael B. Vincent, Zhiwei Gong, Douglas G. Mitchell | 2016-12-13 |
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Alan J. Magnus, Douglas G. Mitchell +3 more | 2016-11-22 |
| 9355985 | Microelectronic packages having sidewall-deposited heat spreader structures and methods for the fabrication thereof | Michael B. Vincent | 2016-05-31 |
| 9312206 | Semiconductor package with thermal via and method for fabrication thereof | Weng F. Yap | 2016-04-12 |
| 9281293 | Microelectronic packages having layered interconnect structures and methods for the manufacture thereof | Alan J. Magnus, Trung Q. Duong, Zhiwei Gong, Douglas G. Mitchell, Michael B. Vincent +2 more | 2016-03-08 |
| 9263420 | Devices and stacked microelectronic packages with package surface conductors and methods of their fabrication | Michael B. Vincent | 2016-02-16 |
| 9257415 | Stacked microelectronic packages having sidewall conductors and methods for the fabrication thereof | Michael B. Vincent, Jason Wright, Zhiwei Gong | 2016-02-09 |