Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502363 | Wafer level packages and methods for producing wafer level packages having delamination-resistant redistribution layers | Michael B. Vincent, Trung Q. Duong, Zhiwei Gong, Scott M. Hayes, Alan J. Magnus +3 more | 2016-11-22 |
| 9362234 | Shielded device packages having antennas and related fabrication methods | Sergio Pacheco, Weng F. Yap | 2016-06-07 |
| 9343414 | Microelectronic packages having radio frequency stand-off layers | Weng F. Yap | 2016-05-17 |