Issued Patents 2016
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443746 | Floating mold tool for semicondcutor packaging | Zhigang Bai, Xingshou Pang | 2016-09-13 |
| 9362211 | Exposed pad integrated circuit package with mold lock | Wei Gao, Zhiwei Gong, Yanting Tian, Dehong Ye | 2016-06-07 |
| 9324637 | Quad flat non-leaded semiconductor package with wettable flank | Zhigang Bai, Xingshou Pang, Nan Xu | 2016-04-26 |