Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9406625 | Die edge seal employing low-K dielectric material | Zhijie Wang, Zhigang Bai, Jiyong Niu, Huchang Zhang | 2016-08-02 |
| 9362211 | Exposed pad integrated circuit package with mold lock | Wei Gao, Zhiwei Gong, Yanting Tian, Jinzhong Yao | 2016-06-07 |