Issued Patents 2016
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9498898 | Cleaning mechanism for semiconductor singulation saws | Zhigang Bai, Mei Liu, Jiyong Niu, Zhimei Sun, Huchang Zhang | 2016-11-22 |
| 9449901 | Lead frame with deflecting tie bar for IC package | Zhigang Bai, You Ge, Meng Kong Lye | 2016-09-20 |
| 9402549 | Methods and apparatus to estimate ventricular volumes | Shuo Li, Ali Islam, Aashish Goela | 2016-08-02 |
| 9406625 | Die edge seal employing low-K dielectric material | Zhigang Bai, Jiyong Niu, Dehong Ye, Huchang Zhang | 2016-08-02 |
| 9397066 | Bond wire feed system and method therefor | Zhigang Bai, Huchang Zhang | 2016-07-19 |
| 9379035 | IC package having non-horizontal die pad and lead frame therefor | You Ge, Meng Kong Lye | 2016-06-28 |
| 9362212 | Integrated circuit package having side and bottom contact pads | Yanbo Xu, Jianshe Bi, Jinsheng Wang, Fei Zong | 2016-06-07 |
| 9355945 | Semiconductor device with heat-dissipating lead frame | You Ge, Meng Kong Lye | 2016-05-31 |
| 9252114 | Semiconductor device grid array package | Zhigang Bai, Aipeng Shu, Yanbo Xu, Huchang Zhang, Fei Zong | 2016-02-02 |