Issued Patents 2016
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9362212 | Integrated circuit package having side and bottom contact pads | Jianshe Bi, Jinsheng Wang, Zhijie Wang, Fei Zong | 2016-06-07 |
| 9252114 | Semiconductor device grid array package | Zhijie Wang, Zhigang Bai, Aipeng Shu, Huchang Zhang, Fei Zong | 2016-02-02 |