Issued Patents 2016
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9431274 | Method for reducing underfill filler settling in integrated circuit packages | Suriyakala Ramalingam, Manish Dubey, Hsin-Yu Li, Michelle S. Phen, Hitesh Arora +3 more | 2016-08-30 |
| 9330993 | Methods of promoting adhesion between underfill and conductive bumps and structures formed thereby | Yiqun Bai, Yuying Wei, Arjun Krishnan, Suriyakala Ramalingam, Beverly J. Canham +3 more | 2016-05-03 |
| 9269596 | Narrow-gap flip chip underfill composition | Nisha Ananthakrishnan, Yiqun Bai, Arjun Krishnan | 2016-02-23 |
| 9230833 | Methods to prevent filler entrapment in microelectronic device to microelectronic substrate interconnection structures | Manish Dubey, Rajendra C. Dias, Arjun Krishnan, Yiqun Bai, Purushotham Kaushik Muthur Srinath | 2016-01-05 |