Issued Patents 2016
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9514953 | Methods for barrier layer removal | Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani, He Ren | 2016-12-06 |
| 9508561 | Methods for forming interconnection structures in an integrated cluster system for semicondcutor applications | Srinivas D. Nemani, Takehito Koshizawa, He Ren | 2016-11-29 |
| 9437479 | Methods for forming an interconnect pattern on a substrate | Suketu Arun Parikh | 2016-09-06 |
| 9425092 | Methods for producing interconnects in semiconductor devices | Ismail Emesh, Roey Shaviv | 2016-08-23 |
| 9368448 | Metal-containing films as dielectric capping barrier for advanced interconnects | Yihong Chen, Abhijit Basu Mallick, Srinivas D. Nemani | 2016-06-14 |
| 9337051 | Method for critical dimension reduction using conformal carbon films | Bencherki Mebarki, Bok Hoen Kim, Deenesh Padhi, Li Yan Miao, Pramit Manna +4 more | 2016-05-10 |
| 9318383 | Integrated cluster to enable next generation interconnect | Abhijit Basu Mallick, Kiran V. Thadani, Zhenjiang Cui | 2016-04-19 |
| 9312168 | Air gap structure integration using a processing system | He Ren, Zhenjiang Cui | 2016-04-12 |
| 9305831 | Integrated metal spacer and air gap interconnect | He Ren | 2016-04-05 |
| 9299605 | Methods for forming passivation protection for an interconnection structure | He Ren, Yong Cao, Sree Rangasai V. Kesapragada, Mei-Yee Shek, Yana Cheng | 2016-03-29 |
| 9299577 | Methods for etching a dielectric barrier layer in a dual damascene structure | He Ren, Chia-Ling Kao, Sean S. Kang, Jeremiah T. Pender, Srinivas D. Nemani | 2016-03-29 |
| 9269563 | Methods for forming interconnect structure utilizing selective protection process for hardmask removal process | He Ren | 2016-02-23 |
| 9257330 | Ultra-thin structure to protect copper and method of preparation | Amit Chatterjee, Geetika Bajaj, Pramit Manna, He Ren, Tapash Chakraborty +3 more | 2016-02-09 |