| 9481940 |
Electrodeposition system and method incorporating an anode having a back side capacitive element |
Jürg Stahl |
2016-11-01 |
| 9466547 |
Passivation layer topography |
Brian M. Erwin, Jeffrey P. Gambino, Christopher D. Muzzy, Wolfgang Sauter |
2016-10-11 |
| 9428841 |
Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solution |
Stephen G. Dutka, Phillip W. Palmatier, John R. Pennacchia, Freddie Torres |
2016-08-30 |
| 9425164 |
Low alpha tin |
Michael S. Gordon |
2016-08-23 |
| 9401336 |
Dual layer stack for contact formation |
Harry D. Cox, Brian M. Erwin, Sarah H. Knickerbocker, Karen P. McLaughlin, David J. Russell |
2016-07-26 |
| 9396991 |
Multilayered contact structure having nickel, copper, and nickel-iron layers |
Harry D. Cox, Eric D. Perfecto, Thomas A. Wassick |
2016-07-19 |
| 9379007 |
Electromigration-resistant lead-free solder interconnect structures |
KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu, Clare J. McCarthy +4 more |
2016-06-28 |
| 9359687 |
Separation of alpha emitting species from plating baths |
Michael S. Gordon |
2016-06-07 |
| 9347147 |
Method and apparatus for controlling and monitoring the potential |
Harry D. Cox, Hariklia Deligianni, George J. Scott |
2016-05-24 |
| 9324669 |
Use of electrolytic plating to control solder wetting |
Brian M. Erwin, Eric D. Perfecto, Wolfgang Sauter |
2016-04-26 |
