Issued Patents 2016
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9379007 | Electromigration-resistant lead-free solder interconnect structures | Charles L. Arvin, KENNETH BIRD, Charles C. Goldsmith, Sung K. Kang, Minhua Lu +4 more | 2016-06-28 |