Issued Patents 2016
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9502347 | Microelectronic assemblies formed using metal silicide, and methods of fabrication | Hong Shen, Liang Wang | 2016-11-22 |
| 9402312 | Circuit assemblies with multiple interposer substrates, and methods of fabrication | Hong Shen, Zhuowen Sun, Charles G. Woychik | 2016-07-26 |
| 9397038 | Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substrates | Cyprian Emeka Uzoh, Charles G. Woychik, Hong Shen, Zhuowen Sun, Liang Wang +1 more | 2016-07-19 |
| 9373585 | Polymer member based interconnect | Cyprian Emeka Uzoh, Rajesh Katkar, Charles G. Woychik, Guilian Gao | 2016-06-21 |
| 9368479 | Thermal vias disposed in a substrate proximate to a well thereof | Rajesh Katkar, Cyprian Emeka Uzoh | 2016-06-14 |
| 9355997 | Integrated circuit assemblies with reinforcement frames, and methods of manufacture | Rajesh Katkar, Laura Wills Mirkarimi, Charles G. Woychik | 2016-05-31 |
| 9331043 | Localized sealing of interconnect structures in small gaps | Rajesh Katkar, Cyprian Emeka Uzoh | 2016-05-03 |
| 9252127 | Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufacture | Hong Shen, Charles G. Woychik | 2016-02-02 |