Issued Patents 2011
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076788 | Off-chip vias in stacked chips | Ilyas Mohammed, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2011-12-13 |
| 8071424 | Substrate for a microelectronic package and method of fabricating thereof | Craig Mitchell, Apolinar Alvarez, Jr. | 2011-12-06 |
| 8067267 | Microelectronic assemblies having very fine pitch stacking | Craig Mitchell | 2011-11-29 |
| 8058101 | Microelectronic packages and methods therefor | Teck-Gyu Kang, Ilyas Mohammed, Ellis Chau | 2011-11-15 |
| 8053281 | Method of forming a wafer level package | Kenneth Honer, David Ovrutsky, Charles Rosenstein, Guilian Gao | 2011-11-08 |
| 8046912 | Method of making a connection component with posts and pads | Yoichi Kubota, Teck-Gyu Kang, Jae M. Park | 2011-11-01 |
| 8050042 | Clock routing in multiple channel modules and bus systems and method for routing the same | Ravindranath Kollipara, David Nguyen | 2011-11-01 |
| 8043895 | Method of fabricating stacked assembly including plurality of stacked microelectronic elements | Ilyas Mohammed | 2011-10-25 |
| 8039363 | Small chips with fan-out leads | Masud Beroz | 2011-10-18 |
| 8034665 | Microelectronic package with thermal access | Stuart E. Wilson | 2011-10-11 |
| RE42785 | Semiconductor module with serial bus connection to multiple dies | — | 2011-10-04 |
| 8026611 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Ilyas Mohammed | 2011-09-27 |
| 8022527 | Edge connect wafer level stacking | Vage Oganesian | 2011-09-20 |
| 8008785 | Microelectronic assembly with joined bond elements having lowered inductance | Philip Damberg, Philip R. Osborn | 2011-08-30 |
| 7999397 | Microelectronic packages and methods therefor | Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan, John Riley +1 more | 2011-08-16 |
| 7999379 | Microelectronic assemblies having compliancy | — | 2011-08-16 |
| 7994622 | Microelectronic packages having cavities for receiving microelectric elements | Ilyas Mohammed, Wael Zohni, Philip R. Osborn | 2011-08-09 |
| 7989940 | System and method for increasing the number of IO-s on a ball grid package by wire bond stacking of same size packages through apertures | Masud Beroz | 2011-08-02 |
| 7989929 | Direct-connect signaling system | Joseph Fjelstad, Para K. Segaram | 2011-08-02 |
| RE42429 | Semiconductor module with serial bus connection to multiple dies | — | 2011-06-07 |
| 7952195 | Stacked packages with bridging traces | — | 2011-05-31 |
| 7939934 | Microelectronic packages and methods therefor | David Gibson | 2011-05-10 |
| 7935568 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, David Ovrutsky, Charles Rosenstein, Giles Humpston | 2011-05-03 |
| RE42318 | Semiconductor module with serial bus connection to multiple dies | — | 2011-05-03 |
| 7923851 | Microelectronic assembly with impedance controlled wirebond and conductive reference element | Brian Marcucci | 2011-04-12 |