Issued Patents 2011
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076788 | Off-chip vias in stacked chips | Belgacem Haba, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2011-12-13 |
| 8058101 | Microelectronic packages and methods therefor | Belgacem Haba, Teck-Gyu Kang, Ellis Chau | 2011-11-15 |
| 8043895 | Method of fabricating stacked assembly including plurality of stacked microelectronic elements | Belgacem Haba | 2011-10-25 |
| 8026611 | Stacked microelectronic packages having at least two stacked microelectronic elements adjacent one another | Belgacem Haba | 2011-09-27 |
| 7999397 | Microelectronic packages and methods therefor | Belgacem Haba, Masud Beroz, Teck-Gyu Kang, Yoichi Kubota, Sridhar Krishnan +1 more | 2011-08-16 |
| 7994644 | Package stacking through rotation | — | 2011-08-09 |
| 7994622 | Microelectronic packages having cavities for receiving microelectric elements | Belgacem Haba, Wael Zohni, Philip R. Osborn | 2011-08-09 |
| 7964947 | Stacking packages with alignment elements | Chung-Chuan Tseng | 2011-06-21 |
| 7901989 | Reconstituted wafer level stacking | Belgacem Haba, Vage Oganesian, David Ovrutsky, Laura Wills Mirkarimi | 2011-03-08 |