Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080874 | Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween | Jeremy Werner, Daniel L. Rosenband, Jeremy Matthew Plunkett, William L. Schmidt, David T. Wang +4 more | 2011-12-20 |
| 8081474 | Embossed heat spreader | William L. Schmidt, Michael J. Smith, Jeremy Matthew Plunkett | 2011-12-20 |
| 7994622 | Microelectronic packages having cavities for receiving microelectric elements | Ilyas Mohammed, Belgacem Haba, Philip R. Osborn | 2011-08-09 |