Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8008785 | Microelectronic assembly with joined bond elements having lowered inductance | Belgacem Haba, Philip Damberg | 2011-08-30 |
| 7994622 | Microelectronic packages having cavities for receiving microelectric elements | Ilyas Mohammed, Belgacem Haba, Wael Zohni | 2011-08-09 |