Issued Patents 2011
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8076788 | Off-chip vias in stacked chips | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, Laura Wills Mirkarimi | 2011-12-13 |
| 8053281 | Method of forming a wafer level package | Kenneth Honer, Belgacem Haba, Charles Rosenstein, Guilian Gao | 2011-11-08 |
| 7935568 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, Charles Rosenstein, Belgacem Haba, Giles Humpston | 2011-05-03 |
| 7936062 | Wafer level chip packaging | Giles Humpston, Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian +7 more | 2011-05-03 |
| 7901989 | Reconstituted wafer level stacking | Belgacem Haba, Ilyas Mohammed, Vage Oganesian, Laura Wills Mirkarimi | 2011-03-08 |