Issued Patents 2011
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7935568 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, David Ovrutsky, Charles Rosenstein, Belgacem Haba | 2011-05-03 |
| 7936062 | Wafer level chip packaging | Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian, Robert Burtzlaff +7 more | 2011-05-03 |