Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8053281 | Method of forming a wafer level package | Kenneth Honer, Belgacem Haba, David Ovrutsky, Guilian Gao | 2011-11-08 |
| 7935568 | Wafer-level fabrication of lidded chips with electrodeposited dielectric coating | Vage Oganesian, David Ovrutsky, Belgacem Haba, Giles Humpston | 2011-05-03 |
| 7936062 | Wafer level chip packaging | Giles Humpston, Michael J. Nystrom, Vage Oganesian, Yulia Aksenton, Osher Avsian +7 more | 2011-05-03 |