Issued Patents 2011
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8080874 | Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween | Jeremy Werner, Daniel L. Rosenband, Jeremy Matthew Plunkett, William L. Schmidt, David T. Wang +4 more | 2011-12-20 |
| 8079848 | Electrical connector with conductors with a ramp to induce torsion | Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Para K. Segaram | 2011-12-20 |
| 8067777 | Light emitting diode package assembly | — | 2011-11-29 |
| 8047855 | High speed, direct path, stair-step, electronic connectors with improved signal integrity characteristics and methods for their manufacture | Gary Yasamura, William F. Wiedemann, Para K. Segaram, Kevin P. Grundy | 2011-11-01 |
| 8026600 | Controlled impedance structures for high density interconnections | Kevin P. Grundy | 2011-09-27 |
| 7989929 | Direct-connect signaling system | Para K. Segaram, Belgacem Haba | 2011-08-02 |
| 7981703 | Electronic assemblies without solder and methods for their manufacture | — | 2011-07-19 |
| 7973391 | Tapered dielectric and conductor structures and applications thereof | Kevin P. Grundy, Para K. Segaram, Gary Yasumura | 2011-07-05 |
| 7948093 | Memory IC package assembly having stair step metal layer and apertures | — | 2011-05-24 |
| 7943434 | Monolithic molded flexible electronic assemblies without solder and methods for their manufacture | — | 2011-05-17 |
| 7926173 | Method of making a circuit assembly | — | 2011-04-19 |
| 7919355 | Multi-surface IC packaging structures and methods for their manufacture | Para K. Segaram, Thomas Obenhuber, Kevin P. Grundy | 2011-04-05 |
| 7909615 | Torsionally-induced contact-force conductors for electrical connector systems | Gary Yasumura, Kevin P. Grundy, William F. Wiedemann, Para K. Segaram | 2011-03-22 |
| 7872344 | Microelectronic assemblies having compliant layers | Konstantine Karavakis | 2011-01-18 |