Issued Patents 2011
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8065792 | Method for packaging circuits | Yong Poo Chia, Low Siu Waf, Suan Jeung Boon, Swee Kwang Chua | 2011-11-29 |
| 8008126 | Castellation wafer level packaging of integrated circuit chips | Boon Suan Jeung, Chia Yong Poo, Low Siu Waf, Chua Swee Kwang, Huang Shuang Wu +2 more | 2011-08-30 |
| 7947529 | Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methods | Chia Yong Poo, Boon Suan Jeung, Tay Wuu Yean | 2011-05-24 |